专利名称：INTEGRATION OF DISTRIBUTED
THERMOELECTRIC HEATING AND COOLING
发明人：Tarek Makansi,Michael J. Berman,John
Latimer Franklin,Mark Nelsen Evers,StevenWood
申请号：US15426733申请日：20170207
公开号：US20170159980A1公开日：20170608
专利附图：
摘要：A thermoelectric device comprising an elongated panel, formed of a thermally
insulating material, and having a plurality of thermoelectric elements comprisingcompacted conductors inside the insulating material and expanded conductors outsidethe insulating material wherein the thermoelectric elements run substantially parallel toor at an acute angle relative to the long dimension of the panel. The thermoelectricdevice may be integrated into a variety of surfaces or enclosures needing heating orcooling with controls and configurations to optimize the application.
申请人：Tempronics, Inc.
地址：Tucson AZ US
国籍：US
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