h November 28, 1995 ELECTRONIC GROUP COMPONE SHARP CORPORATION OPTO-ELECTS DEVICES DIV. SPECIFICATION F \\ DEVICE SPECIFICATION FOR Business dealing name PHOTOCOUPLER MODEL No. PC817 1. These specification sheets include the contents under the copyright of Sharp Corporation Please keep them with reasonable care as important information. Please don’t reproduce or cause anyone reproduce them without Sharp’s consent. 2. Please obey the instructions mentioned below for actual use of this device. SHARP takes no responsibility for damage caused by improper use of the devices. (I) This device is designed for general electronic Main uses of this device are as follows; * Computer - OA equipment (“Sharp”]. equipment. equipment - Telecommunication (Terminal) Home appliance, etc. - Measuring equipment Tooling machine - AV equipment [ (2) Please take proper steps in order to maintain reliability and safety, in case this device is used for the uses mentioned below which require high reliability. - Unit concerning - Traffic signal control and safety of a vehicle (air plane, train, automobile * Gas leak detection breaker * Fire box and burglar extremely etc.) 1 alarm box * Other safety equipment, etc. [ (3) Please do not use for the uses mentioned - Space equipment * Telecommunication * Medical [ * Nuclear control equipment below which require equipment equipment (Trunk) etc. high reliability. 1 1 Contact a SHARP representative of sales office in advance when you intend to use S?%4.RP devices for any applications other than those applications for general electronic equipment recommend by SHARP at (1). CUSTOMER’S APPROVAL DATE PRESENTED BY T. Matsumura, Department General Manager of Engineering Dept.,11 Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION DATE BY SHARP CORPORATION 1 i November 28. 1995 1 1. Application This specification applies to the outline and characteristics Model No. PC8 17series. 2. Outline Refer to the attached drawing No. CY7073K02. of photocoupler 3. Ratings and characteristics Refer to the attached sheet, page 3 to 6. 4. Reliability Refer to the attached 5. Incoming inspection sheet, page 7. Refer to the attached sheet, page 8. 6. Supplement 6.1 Isolation voltage shall be measured in the following method. collector (11 Short between anode to cathode on the primary to emitter on the secondary side. (21 The dielectric withstand tester with zero-cross side and between circuit shall be used. in insulation oil.) (3) The wave form of applied voltage shall be a sine wave. (It is recommended that the isolation voltage be measured SHARP CORPORATION 6.2 Business dealing name (” 0” mark indicates business dealing name of ordered product) Rank mark Ic (mA) 2.5 to 30 4.0 to 8.0 6.5 to 13 10to20 15 to 30 4.0to 13 : 6.5 to 20 10 to 30 4.0 to 20 6.5 to 30 1 4.oto30 1,=5mA vc,=5v Ta=25’C Test conditions Ordered nroduct 0 Business dealingname PC817Xl PC817XIl PC8 17XI2 PC8 17XI3 PC8 17XI4 PC817XI5 PC8 17Xi6 A, B, C, D or no mark A B C D AorB B or C C or D A, B or C B, CorD A, B, C or D . I I 1 1 PC817XI7 PC8 172U8 I PC8 17XI9 1 PC817XIO 1 I 1 6.3 This Model is approved Approved by UL. Model No. : PC8 17 UL file No. : E64380 6.4 This product This product This product 7. Notes is not designed against irradiation. is assembled incorporates with electrical non-coherent input and output. light emitting diode. Refer to the attached sheet- 1 - 1, 2. Ta=25”C l 1 Forward current Collector current power dissipation Ic PC Ptot viso Topr Tstg Tsol 50 150 200 5 -30 to +lOO -55 to +125 260 temperature mA mW mW kVrms ‘C “C “C *l Collector *l Total power dissipation *3 Isolation Operating voltage temperature Storage temperature *4 Soldering temperature ‘1 The derating factors of absolute maximum are shown in Fig. 1 to 4. *2 Pulse width_IlOO ratings due to ambient ,us, Duty ratio : 0.001 (Refer to Fig. 5) *3 AC for 1 min, 40 to 6O%RH l 4 For 10s SHARP CORPORATION 3.2 Electra-optical characteristics r Input Parameter Forward voltage voltage Syllhl VF vFM 1, Ct kE0 BvCEO Condition IFI,=20mA Im=0.5A v,=4v v=o, f=lkHz vc,=20v, Ic=O. 1mA IF.=0 I,=10 /LA, I,=0 IF=0 MIN. TYP. 1.2 MAX. 1.4 3.0 10 Unit v v PA pF nA V V Peak forward Reverse current Terminal capacitance Dark current Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current Collector-emitter saturation voltage Isolation Transfer charac- teristics resistance - :- 35 30 - - 250 100 - output BvECO 6 - - Ic V CEfsat) R IS0 cf fc I,=5mA.VcE=5V 1,=2omA Ic=lmA DC500V 40 to 6O%FW v=o, f=lMHz vc,=5v, Ic=2mA R,=lOO R, -3dB vc,=2v Ic=2mA R,=lOO R 2.5 - 0.1 30 0.2 - 1.0 - mA v Q pF kHz 5XlO’O 1o’l 0.6 Floating capacitance Cut-off frequency Rise time Fall time - 80 tr lf 4 3 18 18 pus pus Rank mark mark l 2 i 6. 5’0.5 1 Pin Nos. and internal cdnnection diagram 7. 62ro- 3 d 2 d T 1. oy 10. oz. 5 1 1. 1 l-J 2. 54 $0.25 UNIT: l/l mm l 2) Factory identification mark shall be or shall not be marked. PC817 SHARP CORPORRTION (Fig. 1) Forward current vs. ambient temperature (Fig. 2) Diode power diss&iok<->, vs. ambient temperature -.. 5 2 .+ i P t; 80 70 60 40 20 3 & 4 -30 0 25 55 75 100 125 Ta ( “C ) -30 0 Ambient 25 55 75 100 125 Ta ( ‘C ) Ambient temperature temperature (Fig. 3) Collector power dissipation vs. ambient temperature (Fig. 4) Total power dissipation vs. ambient temperature -30 0 25 50 75 100 125 Ta ( ‘C ) r -30 0 Ambient 25 50 75 100 125 Ta (‘C ) Ambient temperature temperature 2 2000 1000 i 500 2 200 z .5 (Fig. 5) Peak forward current vs. duty ratio PulsewidthS Ta=25’C ps ; 100 m” 50 z 2 20 Y 10 2 5 lo-‘2 5 lo”2 5 lo-‘2 5 10” e Duty ratio J SHARP CORPORATION 4. Reliability The reliability of products shall be satisfied with items listed below. Confidence level : 90% LTPD: 10%/20% Test Items Solderability “2 Test Conditions $1 23O”C, 5 s 260°C. 10 s Weight : 5N 5 s/each terminal Weight : 2.5N 2 times /each terminal 15000m/s2, 0.5ms 3 times/ tX, +Y, fZ direction 100 to 2000 to 1ooHz/4min 200m/s2 4 times/ X, Y, 2 direction 1 cycle -55 ‘C to t 125°C (30mir-i) (30mi.n) 20 cycles test U High temp. and high humidity storage High temp. storage Low temp. storage Operation life +6O’C, 9O%RH, lOOOh Failure Judgement Criteria Samples (nl Defective(C) n=ll, n=ll, n=ll, v,>ux I,>UXZ Icso >‘ux2 Mechanical shock rc
’ ’ ’ O2 C=O C=O C=O Soldering heat Terminal strength (Tension) Terminal strength (Bending) *3 1.2 n=ll, n=ll, C=O C=O Variable frequency vibration n=ll, C=O Temperature cycling n=22,C=O Upper specification limit L : Lower specification limit n=22,C=O n=22 ,C=O i-i=22 ,C=O n=22.C=0 +125”C, lOOOh -55”C, 1 OOOh I,=SOmA, Ptot=200mW Ta=25”C, 1 OOOh to JIS C 7021. *l Test method, conforms ‘2 Solder shall adhere at the area of 95% or more of immersed portion of lead and pin hole or other holes shall not be concentrated on one portion. *3 Terminal bending direction is shown below. SHARP CORPORATION 5. Incoming inspection 5.1 Inspection items (11 Electrical characteristics V,, I,, I,,, VCE:(satj, Ic, R,,, Visa (2) Appearance - 5.2 Sampling method and Inspection level A single sampling plan, normal inspection level II based on IS0 2859 is applied. The AQL according to the inspection items axe shown below. Defect Inspection item AQL (%) SHflRP CORPORATION Precautions for Photocouplers 1 For cleaning (1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less (2) Ultrasonic cleaning : The affect to device by ultrasonic cleaning is different by cleaning bath size, ultrasonic power output, cleaning time, PWB size or device mounting condition etc. Please test it in actual using condition and con&m that doesn’t occur any defect before starting the ultrasonic cleaning. Applicable solvent : Ethyl alcohol, Methyl alcohol Freon TE * TF. DifIon-solvent S3-E Please refrain form using Chloro Fluoro Carbon type solvent to clean device as much as possible since it is internationally restricted to protect the ozonosphere. Before you use alternative solvent you are requested to confirm that it does not attack package resin. 2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light emission power of the LED. (50% / 5years) SHflRP CORPORRTION 3. Precaution ( 11 If solder refIow : for Soldering Photocoupler It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure. I 230t 200°C 180°C - 25°C (2) Other precautions An infbared Iamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item (1). Also avoid immersing the resin part in the solder. This datasheet has been download from:www.datasheetcatalog.comDatasheets for electronics components.