PCBA检验规范
编 号： 版 本：V1.0 生效日期：
1．修订情况表
修订历史 版本
2．术语表
术语表 名称
说明 说明 作者 审核 批准 生效日期
文档说明页
目 录
1. 目的(PURPOSE) .................................................................................................................................1 2. 范围(SCOPE) ......................................................................................................................................1 3. 名词解释(WORDS EXPLANATION) ...................................................................................................1 4. 参考文件(REFERENCE DOCUMENT) ...............................................................................................1 5. 职责(RESPONSIBILITY)…………………………………………………………………… ….……………1 6. 作业流程及内容(Flow chart and content)……………………………………………………………..….1 7. 修订权限(AUTHORITY OF MODIFICATION)………………………………………………………………2 8. 附件(ATTACHMENT)………………………………………………………………………………………….2
8.1 附件一(PCBA)……………………………………………………………………………………...4 8.2 附件二(机构类)…………………………………………………………………………………….42 8.3 附件三(其它)……………………………………………………………………………………….52
深圳国人通信有限公司
目录
PCBA检验规范
PCBA检验规范
1 目的(Purpose)
建立产品外观目视检验标准, 使产品检验之判定有所依循, 同时藉由检验资料的回馈分析建立良好的workmanship,防止不良之发生.
To establish the standard inspection of product cosmetic for operation to follow, and establish well workmanship by feedback and analyzing the inspection document to void failure.
2 范围(Scope)
本规范适用于所有产品(含半成品及成品PCBA)的外观目视检验, 包含自行生产制造之PCBA, 委托外包生产制造之PCBA, 以及外购入厂组立或单独包装出货之PCBA等.
It fits all product(containing product and PCBA) appearance inspection, including PCBA made by self or by other company and other.
3 名词解释(Words explanation)
无(None)
4 参考文件(Reference document)
ANS/IPC-A-610D
5 职责(Responsibility)
5.1 生产单位(Production unit):
负责产品检验之执行.
Be responsible for doing product inspection
5.2 质量管理部(Quality unit):
负责产品规格之制定及产品品质之抽样检验管制
Be responsible for making product specification and controlling the spot check of product quality
6 作业流程及内容(Flow chart and content )
6.1检验前的准备(preparation for inspecting):
- 1 -
PCBA检验规范
检验前须先确认所使用的工具,材料,胶,清洁剂等,是否合乎规定. 检验PCBA 时必须配戴防静电手套或防静电手环, 而成品有外壳部分则不在此限.
Before inspecting, be sure of the tool, material, glue, cleanser, etc. Operator should have wrist strap or electrostatic glove for prevention ESD(Electronic static Discharge ), but the finished good with。
6.2
若有检验标准未规范的异常现象发生时，不代表该产品允收或拒收，应向值班工程师询问。 It is not means the product accept or reject that the standard of inspection have some abnormal , but should feed back to engineer to confirm.
6.3
检验环境要求光线充足,以目视为主,辅以放大镜和卡尺
6.4
外观检验项目基准参见附件一~三。
The item of cosmetic inspection standard reference Appendix 1 to 3.
7 修订权限(Authority of modification)
本规范由质量管理部工程师撰写, 经研发单位及生产单位会签, 由质量管理部最高主管核准后实施, 修改程序亦同.
This criteria is prepared by Quality unit engineer and signed off with R&D(Research and Develop department )and Production unit, and then approve by Quality manager. Modify procedure as the same above.
8 附件Attachment ( 含记录表单)
8.1 附件一：PCBA
Appendix 1: PCBA 8.2 附件二：机构类
Appendix 2: Mechanical 8.3 附件三：其它
Appendix 3: Other
附 件 预 览 总 表
- 2 -
PCBA检验规范 附件二: 机构类附件一: PCBA类 (Mechanical) 1 SMT零件(SMT component) 1-1 焊点规格(Soldering SPEC) 1-2 焊点异常(Soldering abnormal) 1-3 零件损坏(Component damage) 1-4 点胶(Staking adhesive gluing) 2 Dip 零件(DIP component) 2-1 焊点规格(DIP SPEC) 2-2 引脚突出(Lead protrusion) 2-3 通孔(PTH) 2-4 插件外观(Appearance) 2-5 点胶(Adhesive gluing) 2-6 DIP高翘(DIP component lifted) 3 PCB 3-1 marking 3-2 外观(Surface appearance) 3-3 焊锡性(Solderability) 4 Connector, PIN & 金手 指(Golden finger) 5 其它(Other) 5-1 螺丝(Screw) 5-2 跳线(Jump)
1 外壳(Housing) 2 托架,承座(Chassis) 3 铭板(Overlay) 4 散热片(Heat sink) 5 绝缘片(Insulator) 6 螺丝,螺帽,垫片(Screw nut) 7 DC series converter 系列成品外观检验标准 8 Transformer 9 Shielding cover 外观检验标准 附件三: 其它(Other) 1 标签(Label) 2 Barcode 3 包装袋(PE bag) 4 外箱(Carton) 5 Housing 附件一: PCBA类
1 SMT零件(SMT component)
1-1 焊点规格(Soldering SPEC)
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PCBA检验规范
1-1-1 Chip 零件(Chip component)
Defect
Side overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less
零件偏移D>50% W 或D>50% P 拒收
Defect
Side overhang (D) is greater than 50% component termination width (W) or 50% land width (P) whichever is less
零件偏移D>50% W 或D>50% P 拒收
Defect
Any end overhang (B) 零件超出pad 拒收
Defect
Component in reserved to lacquer to go to circuit to form a short circuit
零件在有保护漆之线路上造成短路拒收
Acceptable
End joint width (C) is minimum 50% of component termination width (W) or 50% land width (P) whichever is less
零件焊点宽度C>50%W or C>50% P 允收
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PCBA检验规范
Acceptable
Maximum fillet height (E) may overhang the lend or extend onto the of the end cap metallization, but not extend further onto the component body 锡高超过金属端,但未延伸至零件本体允收
Defect
Solder fillet extends onto the component body 锡延伸到零件本体上拒收
Defect
Minimum fillet high (F) is less than 25% termination high (H), or fillet high (F) is less than 0.5mm
High voltage capacitance minimum fillet high (F) is less than 50% termination high (H), or fillet high (F) is less than 0.75mm
爬锡高度 F<25% H 或 F<0.5mm 拒收
高压电容爬锡高度 F<50% H 或 F<0.75mm 拒收
Defect
Insufficient solder 锡不足拒收
Defect
Insufficient end overlap 空焊拒收
1-1-2 圆柱体零件(Cylindrical End Cap Termination)
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PCBA检验规范
Defect
Side overhang (A) is greater than 50% of component diameter,(W),or land width (P),whichever is less 零件直径突出A>50% W or >50% P. 拒收
Defect
Any end overhang (B) 零件超出pad 拒收
Acceptable
End joint width (C) is minimum 50% component diameter (W) or land width (P),whichever is less 零件连接直径宽度C≧50% W or 50% P 允收
- 6 -
PCBA检验规范
Acceptable
Side joint length(D) is minimum 50% length of component termination(T) or land length(S), whichever is less
侧面焊点长度D≧50%T or 50%S 允收
Defect
Solder fillet extends onto the component body 锡延伸到零件本体上拒收
Acceptable
Minimum fillet heitht(F) is solder thickness(G) plus 25% diameter(W) of the component end cap 焊锡高度F≧25%(G+W) 允收
Acceptable
End overlap(J) between the component termination and the land is minimum 50% the length of the component termination(T)
零件末端与PAD重叠部分J≧50%T 允收
Defect
End overlap(J) is less than 50% of the length of component
零件末端与PAD重叠部分J<50%T 拒收
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PCBA检验规范
1-1-3 Leadless chip
Defect
Side overhang (A) exceeds 50% castellation width (W) 侧面偏移 A>50% W 拒收
Defect
End joint width (C) is less than 50% castellation width (W)
零件末端焊点宽度 C<50% W 拒收
Defect
Minimum side joint length (D) is less than 50% minimum fillet height (F) or land length external to package (S),whichever is less
零件末端焊点长度 D<50% S 或50% F 拒收
Defect
Minimum fillet height (F) is 25% castellation height (H) 焊锡高度 F<25% H 拒收
Defect
Any end overhang (B) 零件超出pad 拒收
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PCBA检验规范
Defect
Minimum fillet height (F) is 25% castellation height (H) 焊锡高度 F<25% H 拒收
1-1-4 扁平、L 型和翼型引脚(Flat Ribbon, L, and Gull Wing Leads)
Acceptable
Maximum overhang (A) is not greater than 50% lead width (W)
侧面偏移 A≦50% W 允收
Defect
Side overhang (A) is greater than 50% lead width (W) 侧面偏移 A>50% W 拒收
- 9 -
PCBA检验规范
Defect
Minimum end joint width (C) is less 50% lead Width (W) 焊点宽度 C<50% W 拒收
Defect
Side joint length(D) is less than 80% of lead length (L) 焊锡长度 D<4/5 L 拒收
Defect
Solder touches the body or end seal of high-lead configuration component
焊锡延伸至零件本体上或封装末端 拒收
Acceptable
爬锡高度: Fillet 接触到正面吃锡面 允收 Defect
Solder touches package body 锡延伸到零件本体上 拒收
- 10 -
PCBA检验规范
Acceptable
Transformer high voltage pin’s solder is over the A corner portion ,but ex no function pin (for all inverters, except special case)
变压器高压Pin吃锡度已达到A 处(第一弯角处) 允收
Acceptable
Solder is over the B portion(for all inverters, except special case)
吃锡度超出B 处 允收
Defect
Solder is already over the B portion, and bobbin had Been damaged by iron . Bobbin 被烙铁烫伤 拒收
Defect
Minimum heel fillet height (F) is less than 25% lead thickness (T)
焊锡高度 F< 25% T 拒收
Defect
Side overhang (A) is greater than 50% lead width/ diameter (W)
零件偏移 A>50% W 拒收
- 11 -
PCBA检验规范
Defect
Minimum end joint width (C) is less than 50% lead width/diameter (W)
焊锡宽度 C<50% W 拒收
Defect
Side joint length (D) is less than 80% lead length 焊锡长度 D 小于 4/5 引脚长度拒收
Defect
Solder touches the package or end seal 焊锡延伸至零件本体上或封装末端拒收
Defect
Minimum side joint height (Q) is less than solder thickness (G) plus 50% diameter (W) of round lead or 50% thickness of lead at joint side (T) for coined lead 焊锡高度Q Defect Side overhang (A) is greater than 50% W 偏移宽度 A>50% W 拒收 - 12 - PCBA检验规范 Acceptable Minimum end joint width (C) is 50% lead width (W) 焊锡宽度 C≧50%W 允收 Defect Side joint fillet (D) less than 150% lead width 焊锡宽度 (D) 小于150% 引脚宽度(W) 拒收 Defect Solder fillet touches package body 焊锡延伸至零件本体上 拒收 1-1-7 I形引脚 (Butt/I Joints) Defect Any toe overhang (B) 侧边突出 拒收 Defect End joint width (C) is less than 75% lead width (W) 焊锡宽度 C<75%W 拒收 Defect Solder touches package body 焊锡延伸至零件本体上 拒收 - 13 - PCBA检验规范 Defect Fillet height (F) is less than 0.5mm[0.02inch] 焊锡高度(F)小于0.5mm 拒收 1-1-8 向内L型引脚(Inward formed L-shaped ribbon leads) Defect End joint width(C) is less than 50% lead with(W) Side overhang(A) is greater than 50%W Minimum fillet height(F) is less than 25% E 焊锡宽度C<50%W 拒收 偏移宽度A>50%W 拒收 焊锡高度F<25% 拒收 Acceptable Minimum end joint width(C) is greater than 50% lead with(W) 焊锡宽度 C≧50%W 允收 1-1-9 BGA 零件(Area array/Ball grid array ) Defect More than 50% overhang 偏移50% 拒收 - 14 - PCBA检验规范 Defect Solder bridge 锡桥 拒收 Dark spots in X-Ray view the bridge between solder joints 在X-Ray下焊点间桥接或 拒收 Solder open 锡散开 拒收 Missing solder 漏锡 拒收 Solder ball(S) that bridge more than 25% of the distance between the leads 锡珠超出焊点间距25% 拒收 Defect Fracture solder connection 锡裂 拒收 1-2 焊点异常(Soldering abnormal) - 15 - PCBA检验规范 1-2-1 侧立(Mounting on side) Defect Chip resistance mounting on side 电阻侧立 拒收 Acceptable Chip capacitance & Inductance minimum type is less than 1206, mounting on side and no more than five(5) chip on each assembly are mounted side ways 电容,电感类零件小于1206(含)以下, 且单面少于5pcs 允收 1-2-2 翻件(Mounting upside down) Acceptable Element of chip component with exposed deposited electrical Element is mounted toward board 能导通 允收 1-2-3 墓碑(Tombstone) Defect Chip component standing on their terminal end(Tombstone) 墓碑 拒收 1-2-4 共平面 (Coplanarity) - 16 - PCBA检验规范 Defect One lead or series of leads on component is out alignment and fails to make proper contact with the land 零件的一个或多个引脚变形，不能与pad 正常接触 拒收 1-2-5 锡未完全熔化(Reflow not complete) Defect Incomplete reflow of solder paste 锡未完全熔化 拒收 1-2-6 空焊 (Nonwetting) Defect Solder has not wetted to the land or termination 空焊 拒收 - 17 - PCBA检验规范 1-2-7 冷焊(Dewetting, Disturbed solder) Defect Characterized by stress lines from movement in the connection while solidifying 冷焊 拒收 1-2-8 锡裂(Fractured solder) Defect Fractured or crack solder 焊锡断裂或破裂 拒收 - 18 - PCBA检验规范 1-2-9 针孔/吹孔(Pinholes/Blowholes) Defect Blowholes, pinholes, voids, etc 焊锡连接出现气泡,气泡,空白,流出物等 拒收 Acceptable 焊点上紧临零件脚的气孔/针孔,一个焊点只允许有一个,且其大小须小于零件脚面积的1/4 允收 Acceptable 焊点上未紧临零件脚的气孔/针孔,一个焊点容许有不超过两个(含),且其大小须小于零件脚面积的1/4 允收 1-2-10 锡桥(短路)[Solder bridge(short)] Defect A solder connection across conductors that should not be joined 锡桥(短路) 拒收 - 19 - PCBA检验规范 Acceptable On the same PAD, solder bridge(short) across conductors 同PAD上两焊点短路 允收 On the same trace(Visualization) but not same PAD, solder bridge(short) across conductors 目视同线路不同PAD短路 允收 1-2-11 锡珠(Solder ball) Defect Solder ball dislodge 非附着性锡珠 拒收 Entrapped or encapsulated solder balls that are exceed 0.2mm in diameter 附着性锡珠但锡珠直径大小为0.2mm （含）以上 变压器高压端及高压电容旁有附着性锡珠 拒收 Solder ball attached on high voltage side of transformer or around high voltage capacitor More than 5 solder balls (diameter less than 0.2mm) per 600mm2 锡珠直径大小为0.2mm 以下但锡珠数量多于 5 颗 / 6 平方公分（含） 拒收 PS:锡珠以静电毛刷刷不掉者,判为附着性锡珠 1-2-12 锡渣(Solder splash) - 20 - PCBA检验规范 Defect Solder splashes that are exceed 0.2mm in length 锡渣长度最长边0.2mm（含）以上 拒收 Solder splashes attached on high voltage side of transformer or around high voltage capacitor 变压器高压端及高压电容旁有锡渣 拒收 More than 5 solder splashes (diameter less than 0.2mm) per 600mm2 锡渣直径大小为0.2mm 以下但锡渣数量多于 5 颗 / 6 平方公分（含） 拒收 PCB 铜箔PAD 沾锡直径大于0.7MM 拒收 1-3 零件损坏(Component damage) 1-3-1 裂缝与缺口(Cracks and chip-outs) - 21 - PCBA检验规范 Acceptable Cracks or chip-outs not greater than dimensions L<50%, W<25%, T<25% 缺口的尺寸L<50%, W<25%, T<25%可接受 Defect Any nick or chip-out that exposes the electrodes 任何电极上的裂缝或缺口 拒收 Cracks, nicks or any type of damage bodied components 玻璃组件本体上的裂缝、刻痕或任何损伤 拒收 Any chip-outs in resistive elements 任何电阻质的缺口 拒收 Any cracks or stress fractures 任何裂缝或压痕 拒收 1-3-2 金属镀层(Metallization) - 22 - PCBA检验规范 Acceptable Maximum of 50% of metallization loss of top end area (for each terminal end) 顶部金属镀层损失不大于50%,侧面金属镀层不得漏底材 允收 Defect Metallization loss exceeds 50% of top area 顶部金属镀层损失大于50% 拒收 1-3-3 剥落(Leaching) Defect Leaching of the terminal ead face exposing ceramic. 剥落导致陶瓷暴露 拒收 Leaching exceeding 25% of component width (W) or component thickness (T) 零件剥落宽度(W)或厚度(T)超出25% 拒收 1-3-4 点胶(Staking adhesive & gluing) Defect Adhesive is present in the solder connection area that reduces solder contact to less than 50% of the component termination width 点胶位于待焊区域，造成焊锡宽度小于50% 拒收 Defect The glue height above A or below B of crystal 振荡器点胶之高度: 高于A或低于B 拒收 Defect The glue height above A or below B of IC IC点胶之高度: 高于A或低于B 拒收 - 23 - PCBA检验规范 2 插件零件(DIP component) 2-1 焊点规格(Soldering SPEC) 2-1-1 焊点可接受性要求(Soldering acceptance) Defect Nonwetting which results in the solder forming a ball or bead on the surface, much as water beads form on a maxed surface. The fillet will be convex; No feathered edge apparent 不润湿导致焊点表面形成粗糙,灰暗或颗粒状,无光滑表面 焊点移位 拒收 Disturbed solder connection or Cold solder connection 空,冷焊 拒收 2-2 焊点凸出(Lead protrusion) Defect The leads protrusion over 2.2 mm 背面脚长大于2.2 mm 拒收 脚直径大于1.0mm, Connector, 变压器Pin无短路及组装干涉问题者脚长可适当放宽 Defect Component to give to conduct electricity a circuit a short circuit 零件与导电线路短路 拒收 2-3 通孔[Plated-through holes(PTH)] 2-3-1 通孔的填充(PTH-vertical fill of hole) Defect Vertical fill of hole is less than 75% 通孔的填充小于75% 拒收 - 24 - PCBA检验规范 2-3-2 通孔的外围焊点-正面(PTH-circumferential wetting-primary side) Defect Less than 180° wetting on lead or barrel 引脚和孔壁焊接不足180° 拒收 2-3-3 通孔的外围焊点-背面(PTH-circumferential wetting-secondary side) Defect Minimum 270° fillet and wetting (lead, barrel and termination area) 引脚和孔壁焊接不足270° 拒收 2-3-4 包焊(Lead not discernible) Defect Fillet convex, lead not discernible due to excess solder, providing visual evidence of the lead in the hole can be determined on the primary side 由于焊锡过多导致包焊 拒收 Defect Lead not discernible due to bent lead 由于引脚弯曲导致包焊 拒收 - 25 - PCBA检验规范 2-3-5 引脚折弯处的焊锡(Solder in lead bent) Defect Solder in bend area comes in contact with the Component body or end seal 引脚折弯处的焊锡接触组件本体或密封端 拒收 2-3-6 陷入焊锡的绝缘层(Meniscus in solder) Acceptable Exhibit good wetting and lead coating meniscus is not discernible within connection on secondary side 背面焊点需完整,不可空/冷焊且零件脚Coating 不超出背面焊点 允收 2-3-7 焊接后的引脚剪切(Lead cutting after soldering) Defect Evidence of fracture between lead and solder fillet 锡裂 拒收 2-4 插件外观(Appearance) 2-4-1 定位-水平(Orientation-Horizontal) Defect Component is not as specified(wrong part) 零件插错件 拒收 Component not mounted I correct holes 零件插错洞 拒收 Polarized component mounted backwards 零件极性反 拒收 Multileaded component not oriented correctly 零件方向错误 拒收 - 26 - PCBA检验规范 Defect Components required to be mounted above the board surface D>1.6mm or H>2.1mm 零件浮起D>1.6mm 或H>2.1mm 拒收 2-4-2 定位-垂直(Orientation-Vertical) Defect Polarized component is mounted backwards 零件极性反 拒收 Acceptable The height of the component body above the H is 0.4mm to 3.2mm 零件高度H不得超出0.4mm~3.2mm 拒收 The angle θ of the component lead does not greater the 45º 零件倾斜度不大于45度 允收 2-4-3 DIP & SIP Defect Title of the component exceeds max component height limits or lead protrusion does not meet acceptance requirement 组件倾斜超出高度上限或引脚未出 拒收 2-4-4 引脚跨越导线(Leads crossing conductors) - 27 - PCBA检验规范 Acceptable Sleeve does not extend into solder connection 绝缘套管不可碰到焊点 Defect Splitting and/or unraveling of sleeving 绝缘套管裂开或断裂 拒收 A component lead crossing an electrically noncommon conductor with a clearance of less than 0.5mm with no separating insulator (lead sleeving or surface coating) 零件脚与线路距离小于0.5mm 拒收 2-4-5 引脚成形 (Leads forming) Acceptable Leads for through-hole mounting extend at least one lead diameter or thickness but not less than 0.8mm form the body, solder bead, or lead weld 零件本体、球状连接部分或引脚焊接部分到零件引脚折弯处的距离L≧0.8mm 允收 Defect Lead forming as a right angle 引脚成形成直角 拒收 Defect Damage or fracture of component body to lead seal 零件的本体或引脚封装处有损伤或裂痕 拒收 - 28 - PCBA检验规范 Defect Lead is damaged more than 10% of the lead diameter Lead deformed 零件引脚损伤超过引脚半径10% 或引脚变形 拒收 2-4-6 IC 损伤 (IC damage) Defect Chip out enters into the seal 密封处有缺口 拒收 Chip out exposes the lead in an area not normally exposed IC脚连接处破损 拒收 There are cracks leading from the chip out. 缺口造成芯片外露 拒收 2-4-7 轴向引脚和玻璃封装体损伤(Axial lead and glass body/seal damage) Acceptable Visible chip in surface coating of component body and internal functional element is not exposed 组件表面有损伤,但未暴露出组件内部材质 允收 Defect The insulating cover is damaged to the extent that the internal functional element is exposed or the component shape is deformed 组件表面的绝缘层受到损伤,造成组件内部材质外露,或组 件严重形变 拒收 Defect Crack in glass insulator/seal 玻璃封装上的残缺引起的裂痕延伸至引脚的密封处 拒收 Cracked or damaged glass bead 玻璃体破裂 拒收 Defect Fractured lead weld, solder bead or component body lead 零件焊接处裂缝或锡珠 拒收 2-4-8 径向又引脚损伤[Radial (two lead) damage] - 29 - PCBA检验规范 Acceptable Minor surface scratches, cuts or chips that do not expose the component substrate or active area 零件表面有损伤但未暴露出零件内部材质 拒收 Structural integrity is not compromised 零件的结构完整性未受到破坏 允收 Defect Active area is exposed or structural integrity is compromised 零件内部材质外露或零件严重形变 拒收 2-5 点胶(Adhesive bonding) Defect Less than 25% of the circumference or equivalent amount of board surface is wetted and adhered to by the adhesive 点胶范围小于周长25% 拒收 On a horizontally mounted component, adhesive adheres to less than 25% component diameter 水平安装零件粘着小于25%直径 拒收 On a vertically mounted component, adhesive adheres to less than 50% of the component length 垂直安装零件粘着小于50%长度 拒收 2-6 DIP零件高翘 IC(插入PCB), SOCKET, ARRAY 高翘≥0.8mm 拒收 电阻,电容,电感高翘≥1.6mm 拒收 IC插入SOCKET未压至底高翘≥0.5mm 拒收 Slot, header高翘≥1.0mm 拒收 Switch, Connector, speaker 高翘≥0.5mm 拒收 无绝缘包装之导线,跳线(含本体)高翘≥2.2mm 拒收 3 PCB 3-1 Marking - 30 - PCBA检验规范 Defect Missing or illegible characters in the markings Marking 字符缺损或模糊造成字体无法辨识 拒收 Open areas of characters are filled and not legible, or are likely to be confused with another number or letter Marking 字符笔画缺损、间断或沾污致使字体无法辨识 拒收 Lines forming a character are missing, broken or smeared to the extent that the character is not legible or is likely to be confused with another character Marking 字符内容错误 拒收 The depth of the marking adversely affects the function of the part Marking 重影造成无法辨识 拒收 3-2 外观(Surface appearance) Defect Discernible residue from cleanable fluxes, or any activated flux residues on electrical contact surfaces 有需清洗焊剂的残留物,或者在焊点有助焊剂残留物 拒收 Defect Dirt and particulate matter on assembly, e.g., dirt, lint, dross, metallic particles, etc 表面沾污残留颗粒物质、纤维丝、残渣、金属颗粒等不属于产品物质之异物 拒收 Defect Transformer 高压端20MM 内露铜直径超过0.5MM 拒收 Acceptable 其余位置露铜直径不超过2MM 且不造成短路 允收 Defect White residue on PWB surface 白色残留物于PCB 表面 拒收 White residues on or around the soldered termination 白色残留物于焊点四周 拒收 Metallic areas exhibit crystalline white deposit - 31 - PCBA检验规范 白色结晶状于金属表面 拒收 Defect Flux residue inhibits visual inspection 助焊剂残留造成焦黑 拒收 3-2-1 腐蚀 (Corrosion) Defect Evidence of corrosion 有明显腐蚀现象 拒收 3-3-2 烧焦(Burn) - 32 - PCBA检验规范 Defect Burns which physically damage surface or the assembly 烧焦 拒收 3-2-3 印刷电路及焊点损伤(Conductor/Land damage) Defect Reduction in width of printed conductor by more than 20% 印刷电路宽度减少大于20% 拒收 Reduction in width of length of lands by more than 20% 焊点长度或宽度减少大于20% 拒收 3-2-4 PCB板弯 Defect PCB板弯超过板长1.5% 拒收 3-3 焊锡性(Solderability) Defect Solder projection violates assembly maximum height requirements 锡尖高于零件 拒收 Defect Separation between conductor, PAD or land and laminate surface is greater than on pad thickness PAD剥离 拒收 - 33 - PCBA检验规范 4 Connector, Pin & 金手指(Golden finger) Defect Back edge of connector is not flush to PCB A>0.8mm, or B>0.4mm 长轴高翘(A)大于0.8mm or短轴高翘(B)大于0.4mm 拒收 Connector not contact with PCB Connector 未接触PCB 拒收 Defect Contact is above insulator Pin 超出connector 拒收 Contacts are twisted or otherwise deformed Pin 歪曲或变形 拒收 Land is damaged 焊点损伤 拒收 Contact is broken 接触簧片断裂 拒收 Gap between contact shoulder and land is greater specified 接触簧片下陷 拒收 Defect Any functional annular ring which is lifted more than 75% of the width (W) Pin 脚底部翘起或龟裂宽度大于75% W 拒收 - 34 - PCBA检验规范 Defect Pin is bent out of alignment. (Pin is bent off center greater than 50% pin thickness.) Pin 脚倾斜度超出一个直径 拒收 Defect Pin visibly twisted Pin脚扭曲 拒收 Defect Pin height is out of tolerance as to Specification Pin脚凸出或下陷超过0.5mm 拒收 Defect Damaged pin as a result of handling or insertion Pin脚尖端电镀脱落 拒收 Mushroomed Pin脚尖端呈晕状 拒收 Bent Pin脚弯曲 拒收 - 35 - PCBA检验规范 Defect Damaged PIN(Exposed basis metal) Pin脚损伤/露铜 拒收 Defect Solder or any other metal than gold in the critical contact area of the fingers 金手指金属接触面有焊锡,沾污,沾胶,氧化,露底材,残留铜 屑 拒收 Scratching and exposed basis material or scratching but not exposed basis material quantity exceed 1/5 gold finger quantity each side 刮伤露底材或刮伤未露底材在单面超过1/5金手指数 拒收 Concave dots in the 80% from edge of board, exceed 0.2mm for Mini PCI or exceed 0.4mm for PCI, and above two dots 凹陷点离金手指板边80%内, Mini PCI超过0.2mm, PCI超过0.4mm且单面超过2 处以上 拒收 Solder dots in the 80% from edge of board, exceed 0.2mm for Mini PCI or exceed 0.4mm for PCI, and above two dots 沾锡点离金手指板边80%内, Mini PCI超过0.2mm, PCI超过0.4mm且单面超过2 处以上 拒收 Solder polluted of gold finger in the 80% from edge of board, exceed 0.2mm for Mini PCI or exceed 0.4mm for PCI, and above two dots 沾污离金手指板边80%内, Mini PCI超过0.2mm, PCI超过0.4mm且单面超过2 处以上 拒收 Oxidized in the gold finger 金手指有氧化现象 拒收 Exposed basis material in the gold finger 金手指露底材 拒收 金手指外观检验品质要求 - 36 - PCBA检验规范 Copper left or pulled in the edge of gold finger 金手指端点有残留铜屑或拉离 拒收 Glue polluted in the gold finger 金手指有残胶 拒收 Aperture in the one gold finger exceed 20% or above one dot each side 缺口在单一金手指面积超过20%或每面超过两处(含两处) 拒收 Convex in the side of gold finger is equal to the decrease of gap about wire. If the gap decrease 20% 侧向突出视同线路间距的减少,线路间距减少超过20% 拒收 Acceptable The marks of insert and draw in the gold finger but not exposed basis material 金手指插拔痕未露底材 允收 Repaired products should be smooth but different color are accept 修护品应平整但有色差 允收 5 其它(含螺丝及跳线) 5-1 螺丝 Defect Hardware(1)contact with conductive path(2) 螺丝与导电线路接触 拒收 Defect Hardware fabricate aperture on to have spare tin ,tobe ready to make fabricate question 螺丝组装孔上有多余的锡,将造成组装问题 拒收 - 37 - PCBA检验规范 Defect Lock washer against nonmetal/laminate 垫片伤到主基板拒收 Flat washer missing 无垫片拒收 Defect Hardware missing or improperly installed 螺丝垫片陷落螺丝孔 拒收 Defect Lock washer not compressed 螺丝垫片高翘 拒收 Defect Wire not wrapped around screw body 线未环绕螺丝 拒收 Wire is overlapped 线重叠 拒收 Solid wire wrapped in wrong direction 线方向错误 拒收 Stranded wire wrapped in wrong direction (tightening the screw unwinds the twisted wire) 线超出螺丝 拒收 Insulation in the contact area 塑料部份锁入螺丝 拒收 - 38 - PCBA检验规范 Defect Hardware has burrs or frayed edges 螺丝滑牙 拒收 5-2 跳线 Defect Wire routed under or over components 跳线跨越零件 拒收 Defect The wire is loose and can extend above the height of adjacent components when pulled taut 跳线未固定且超过邻近零件高度 拒收 Defect Insulation is in the solder 焊点中夹杂塑料部分 拒收 Wire overhangs the land and/or violates minimum electrical clearance 跳线(cable 线)末端超出零件引脚范围 拒收 Defect Solder connection length is less than 50% of land width (L) 焊接长度小于50% L (PAD) 拒收 - 39 - PCBA检验规范 Acceptable Minimum length of the solder connection is 75% of the length (L)(from toe to knee of lead) The wire end does not extend past the top of the component body 跳线与零件脚之焊接长度需75% 且未超出L 允收 Defect Wire or component connection D<75% 跳线与零件连接D 小于75% 拒收 Defect Wire or component connection the opposite direction 跳线与零件焊接反向 拒收 Defect Wire or component connection D>L 跳线与零件连接D 大于L 拒收 Defect Charred insulation 线材绝缘部分烧焦 拒收 Insulation damaged exposing wire 线材绝缘部分损坏 拒收 Defect Birdcaging has caused wire strands to extend beyond the insulation diameter 多蕊导线呈不规则状并超出绝缘层 拒收 The general spiral lay of the strands has not been maintained - 40 - PCBA检验规范 多蕊导线的螺旋状被破坏 拒收 附件二: 机构类(Mechanical) Inspection area defined: (1) 检查面依零件组装后之位置可分为A、B、C、三区: The inspection surface according to component assembly location grouping A, B, C: A 区:产品于使用者正面可见部份,如面板上盖,前面. Zone A: Product of consumer face seeing part example faceplate top, front. B 区:产品于使用者正面不可见部份,如左右侧面上盖. Zone B: Product of consumer face invisible part example left and starboard top, C 区:产品底面及背面. Zone C: Product underside & rear. 面板有Door 之设计时，Door 覆盖部位视为B 区，Door 背面(公模)视为B 区。(DESK TYPE) Faceplate with the design of door, the part wreathe of door was regard as zone B the back of door was also regard as zone B 立、卧两用时，底部外观视 为B 区 - 41 - Desk and tower type the bottom appearance was regard as zone B PCBA检验规范 Tower type 1 Housing(外壳) 外观检验(Visual inspection) Item 质量需求Quality requirement 1.1 需与图面吻合 Object is identical with illustration 1.2 烤漆面不可有流漆、剥落、浮起、龟裂之现象.内部静电漆不可有溢漆 No flow paint & peeling & floating & crack defects in the paint side. No excessive paint inside housing 1.3 文字印刷及Logo 图样不可有模糊不清、断字、重影者 Each character is clear and complete, but not doubt pled stamped( reject)in the word printing and Log drawing 1.4 切断面生锈:只容许有黑皮、锈斑现象. 用白色布擦拭时,不得有红色系氧化的痕迹残留于 白色布表面. 其它部位则不允许生锈 Rust in the section: only black husk & rust are accepted. When wiping with white cloth, no red oxide in the white cloth. Other position is reject 1.5 目视依图标示部位不得有毛边(其它部份需在0.08mm 以下) Raw edge basing on marking drawing is reject.( other position less than 0.08mm) 1.6 刮伤、磨伤、擦伤不可露底材,允许范围如下: - 42 - PCBA检验规范 Not exposed basis material in the scraping or wear and tear. the accepted condition is: 无感刮伤:(目视不明显为无感刮伤) Un-sensible scraping: ( Un-obviously by visual inspection) A 区: 累计总长度≦50mm 可接受. (面积5mm 平方以下) Zone A: total length not exceed 50mm. ( area is less than 5mm) B 区: 累计总长度≦200mm 可接受. (面积20mm 平方以下) Zone B: total length not exceed 200mm . (area is less than 20mm) C 区: 接受 Zone C: accept 有感刮伤: sensible scraping: A 区: 长度2mm*0.2mm 以下每面允许一条. Zone A : Only one of Length each side not exceed 2mm*0.2mm is accept B 区: 长度2mm*0.2mm 以下每面允许四条(10cm 内只能一条) Zone B: Only four of Length each side not exceed 2mm*0.2mm is accept(only one within 10cm) C 区: 长度10mm*0.2mm 以下每面允许二条 Zone C: Only two of length each side not exceed 10mm*0.2mm is accept 异物、杂质、碰伤、压伤、凹凸痕允许范围如下(0.05mm 平方以下均不列入点数计算): foreign matter & foreign substance and collision and pressing or concave and convex marks condition as below:(dots below 0.05mm not counted): A 区: 0.3mm 平方每面允许三点。(10cm 内只能一点) Zone A: Dot 0.3mm, three dots area accept. (only one dot within 10cm) B 区: 0.5mm 平方每面允许四点.(10cm 内只能一点) Zone B: Dot 0.5mm, four dots area accept. (only one dot within 10cm) C 区：0.7mm 平方每面允许五点。(10cm 内只能一点) Zone C: Dot 0.7mm ,five dots area accept. (only one dot within 10cm) 折痕(金属折弯)允许范围如下: crimp mark(for metal)accept condition as below: A 区&B 区: 不允许 Zone A & Zone B are Reject C 区: 无感折痕接受;有感折痕为模具结构造成可接受 Zone C: Un-sensible crimp mark is accept, sensible crimp mark made by the structure of model is accept 表面不可有油渍、色渍、脏污. Oil polluted or color polluted or stain in the surface are reject 接地处(Grounding)不可烤漆 No paint in the grounding 组装螺丝锁固时,螺孔部位烤漆不可脱落 When assemble hardware, no paint peeling in the section of hardware 点焊处间隙不可大于0.5mm The gap of soldering not exceed 0.5mm 上盖、下盖、面板等组装后, 间隙≦0.8mm ,段差≦1.0mm Up/down cover/face board assemble, the gap no more than 0.8mm. the gap of 1.7 1.8 1.9 1.10 1.11 1.12 1.13 - 43 - PCBA检验规范 1.14 segment no more than 1.0mm 点焊处凹、凸痕于烤漆面可视时, 以限度样品签核 When concave and convex marks can be seen in the soldering of paint side, referring to verified sample 2托架、承座(Bracket) 外观检验(Visual inspection) Item 品质需求Quality requirement 2.1 实物需与图面吻合 Object is identical with illustration 2.2 电镀表面不可有目视可见之水斑、起泡、腐蚀 The defects of speckle or blister or corrode can be seen in the surface of electroplate are reject 2.3 文字及图样印刷应鲜明可读, 不可断缺、模糊、重影者 Word printing and Log drawing should be read clearly and each character is clear and complete, but not doubt pled stamped( reject) 2.4 目视不可有生锈、变形、破裂 Rust or distortion or damage by visual are reject. 2.5 目视不可有毛边(毛边尺寸在0.08mm 以下) raw edge by visual is reject (the size is less than 0.08mm) 2.6 正背面不可有油渍、色渍、脏污、异物、杂质 Oil polluted or color polluted or stain or foreign matter or foreign substance in facade and back side are reject 2.7 刮伤、磨伤、擦伤不可露底材,允许范围如下: No exposed basis material of the scraping or wear and tear. the accept condition is: 无感刮伤 (目视不明显为无感刮伤): Un-sensible scraping:(unclearly by visual inspection): 正面: 累积总长度≦200mm 可接受.(面积20mm 平方以下) Facade side: total length is no more than 200mm, area not exceed 20mm 背面: 接受 Back side: accept 有感刮伤: sensible scraping: 正面: 长度2mm*0.2mm 以下, 10cm 距离内允许三条. Facade side: three with length less than 2mm*0.2mm within 10cm are accepted 背面: 长度2mm*0.2mm 以下接受 Back side: length less than 2mm*0.2mm is accepted 2.8 碰伤、压伤、凹凸痕允许范围如下(不可变形、漏底材)：(0.05mm 平方以下均不列入点 数计算) foreign matter &foreign substance &collision & pressing& concave and convex accepted condition as below(no distortion and exposed basis material): (the dot below 0.05mmXmm is not counted) - 44 - PCBA检验规范 正面：0.7mm 平方以下允许三点。 Facade side: not exceed 0.7mmXmm,three dots are accept. 背面：1.0mm 平方以下可接受。 Back side: not exceed 1.0 mm are accept. 电镀挂钩产生白化、黑化、水痕允许范围(0.05mm 平方以下均不列入点数计算): Whiten or blacken or speckle made by electroplate, the accepting condition as below:(the dot below 0.05mm is not counted): 正面: 0.7mm 平方以下允许三点 Facade side: 0.7mm or below, three dots are accept 背面：1.0mm 平方以下可接受 Back side:1.0 mm or below are accept 背胶不可超过铁片边缘 Back rubberized assembled not exceed the edge of iron sheet. 2.9 2.10 3 铭版(Overlay) 外观检验(Visual inspection) Item 品质需求Quality requirement 3.1 实物需与图面吻合 Object is identical with illustration 3.2 刮伤、脏污、破损、折痕等不允许 Scratch and stains and damaged and crimp are reject 背铭版: 若为模具结构造成且无法避免可接受 3.3 烤漆脱落、溢漆、漏白、龟裂浮起等异常现象不允许 The defect of paint broken, excessive paint and exposed white and broken and floating are reject 3.4 文字及图样印刷应鲜明可读，不可断缺、模糊、重影者 Word and drawing printing should be read clearly, each character is clear and complete, but not doubt pled stamped( reject) 3.5 LED 透光区不可偏移超过1/4 及不可变形) Shift exceed 1/4 or distorting are reject in the LED lens 3.6 背胶不良等之异常现象不允许 The defect of back rubberized is reject 3.7 外观污点、色渍、异物等异常, 允许0.2mm 以下一点(LOG 位置不允许) Stains, colors dirty, foreign substance is accept if the dot is one and less than 0.2mm.(it is reject the LOG position) 3.8 LED 透光区内毛边不可进入中心点半径2/3 处 Raw edge must not be in the center of 2/3 radius In the LED lens 4 散热片(Heat-sink) 外观检验(Visual inspection) Item 品质需求Quality requirement 4.1 实物需与图面吻合 - 45 - PCBA检验规范 4.2 4.3 4.4 Object is identical with illustration 目视不可有生锈、变形、破裂 No rust or distorting or damage 目视不可有毛边(毛边尺寸在0.08mm 以下) No raw edge by visual(the size is less than 0.08mm) 正背面不可有油渍、色渍、脏污、异物、杂质 No oil dirty or colors dirty or dirty or foreign matter or foreign substance in facade and back side 5绝缘片insulator 外观检验(Visual inspection) Item 品质需求Quality requirement 5.1 实物需与图面吻合 Object is identical with illustration 5.2 目视不可有变色, 破损长度大于2mm 以上拒收 No various color by visual, the length of damage exceed 2mm is reject 5.3 不可有油渍、色渍、脏污、异物、杂质, 沾胶1mm 平方以下,三点内允收. 点与点距离需 5cm 以上 Oil polluted or color polluted or stain or foreign matter or foreign substance are reject. Glue polluted less than 1mm and the quantity is within 3 dots are accept 5.4 背胶接合处不可有气泡、指印、脏污 Stain or finger print or blister in the contact area of back rubberized are reject 5.5 背胶接合需贴附紧密,剥离现象(爆开)允许条件如下: The contact area of back rubberized should be closely, broken (open) phenomena. the accept condition as below: 绝缘片转折处,剥离现象(背胶层& Kapton )可接受 The broken phenomena(the layer of back rubberized & Kapton) in the flex of insulator is accept. 背胶贴合部位:剥离面积在背胶面积1/4 以内可接受 The sticking position of back rubberized: broken area less than 1/4 of back rubberized is accept. 5.6 不可漏贴背胶、背胶不可歪斜超出机构边缘(如折线) No loss back rubberized, back rubberized not inclined and exceed the edge of housing 6.螺丝、螺帽、垫片(screw nut cushion) 外观检验(Visual inspection) Item 品质需求Quality requirement 6.1 电镀不良、氧化 Electroplate NG and oxidized are reject 6.2 生锈 Rust is reject 6.3 外观成型不良 - 46 - PCBA检验规范 6.4 Visual forming NG is reject 外型尺寸不合规格 Visual size not match Spec is reject 7 DC SERIES CONVERTER 系列成品 Item 外观检验 Visual inspection: A面: 印刷面 B面: 上盖, 两侧及背底部 C面: 灌胶面及内部 品质需求Quality requirement A. 尺寸、颜色: 参考制造规范 Size and color: Reference to manufacturing standard. B. 外壳接缝: 缝隙大小差距大于0.4mm 拒收) The gap of seal exceed 0.4mm is reject 插件type: 灌胶接合边缘不可露出零件,高度不可超过标准PIN Insert type: No exposed component in the edge of mask and height no exceed stand of PIN are reject SMD type: 灌胶接合边缘不可露出零件,高度不可超过标准PIN SMD type: No exposed component in the edge of mask and height no exceed stand of PIN are reject 溢胶现象拒收 Excessive glue is reject 外壳断差大于0.4mm 拒收 The gap of segment exceed 0.4mm is reject C. 刮伤,露底材 Scratch, exposed bottom material A面: 有感刮伤不允许 Sensible scratch is reject B面: 无感刮伤允许, 有感刮伤长度在2mm*0.2mm以下, 每面允许二条 Un-sensible scratch is accept, the sensible scratch length less than 2mm*0.2mm and under two lines each side is accept C面: 无感刮伤允许, 有感刮伤长度在3mm*0.2mm以下, 每面允许三条 Un-sensible scratch is accept, the sensible scratch length less than 3mm*0.2mm and under three lines each side is accept D. 异色,杂质,灌胶,压痕,流痕,碰伤,压伤,气泡: Foreign substance & various color & blister & crimp of filling glue & press: A面: 不允许 Reject B面: 10cm 距离内只允许0.7mm以内,同面只容许有5点(含) - 47 - PCBA检验规范 No exceed 0.7mm between 10cm and less than 5 dots each side is accept C面: 15cm 距离内只允许0.7mm以内,同面只容许有5点(含) No exceed 0.7mm between 15cm and less than 5 dots each side is accept E. 凹痕: 大于 1mm( 有感) (拒收) Concave vesting : exceed 1mm(sensible) are reject. F. 结合线,流痕:大于 5mm (拒收) Flow vesting exceed 5mm is reject G. 表面不洁，颜色不均匀 Surface not clear, color not uniform A 面: 不允许 Reject B 面: 不允许 Reject C 面: 外壳颜色不均匀 (灌胶面允许颜色不均匀) 拒收 Color not uniform on the housing(mask surface are acceptance) are reject H. 表面文字印刷不可模糊或不完整(断字),重影现象拒收 Each character is clear and complete, if doubt pled stamped are reject I. 生锈氧化: Rusted and oxidized 切断面: 起红斑不允许(以白布擦拭不得有红色系氧化痕迹) Broken section: red rust is reject and no red rust after wiping with white cloth 其它部位：不允许 Other section: reject J. REWORK(除锈后防锈处理): 经QA 课级主管确认OK 可接受,但不可涂银漆 Rework(prevent rust after cleaning rust): must get the approval of QA supervisor, but sliver lacquer is not permit A. 不可歪斜(中心值+/- 0.25 mm)、断裂、生锈、沾污、电镀层脱落及氧化现象 (拒收) Inclined not acceptable, broken, rusted, stained, plated-layer broken & oxidized are reject. B. Pin - 48 - PCBA检验规范 铝基板PIN吃锡高度H需大(等)于PIN凹槽位置T 铝基板PIN吃锡宽度A需大(等)于PIN本体宽度W C. 灌胶后PIN脚出现毛细现象以case 标准PIN为基准开始算起0.5mm以内 D. 沾污不大于1mm Stain no exceed 1mm 外盒,外箱等包材 A. 破孔或刮伤大于10mm 拒收 Carton and wrapper Broken aperture or scratch exceed 10mm are reject B. 沾污大于20mm或者潮湿拒收 Stain exceed 20mm or be wet are reject 金属 Case A. 实物需与图面吻合 Object is identical with illustration B. 凹痕,凸痕 Concave and convex marks A面: 直径￠1mm以内每面允许一点 In 1mm of diameter, one dot each side is accept B面: 直径￠1mm以内每面允许二点 In 1mm of diameter, two dot each side is accept C面: 直径￠1mm以内每面允许三点 In 1mm of diameter, three dot each side is accept 8 Transformer 外观检验(Visual inspection) Item 品质需求Quality requirement 8.1 Dummy PIN不可歪斜,高翘 Dummy PIN must not be bending or floating or downhill 8.2 Dummy PIN 不可短路 Dummy PIN must not be short 8.3 Dummy PIN沾锡标准如下: The solder stand of dummy PIN are shown as below: 1. 沾锡不可高出变压器本体高度或超出边缘宽度 The solder must not be over height or edge side of the transformer 2. 沾锡不可接触PCB The solder must not touch PCB - 49 - PCBA检验规范 8.4 Dummy PIN上之锡珠若无短路则为良品 The product will be judged passed if the solder ball on the dummy pin is not short 9 Shieding cover 外观检验 (Visual inspection) Item 品质需求Quality requirement A. 基板与shielding cover裂缝长度小于等于6mm,允收(允许每边一个) B. 基板与shielding cover裂缝长度小于等于2mm,允收(允许每边二个) C. 若单边有3个以上裂缝(包含三个)拒收 D. Shielding cover接缝处若存flux沾污拒收 - 50 - PCBA检验规范 附件三 其它类 1 标签(Label) 外观检验 (Visual inspection) Item 品质需求Quality requirement 1.1 粘贴歪斜不可大于5 度 Deflection of stamped label can not exceed 5 degree 1.2 不可有扭曲现象 No distort phenomena 1.3 Label 面积9 平方公分以下不可有气泡 No blister within 9 square cm of label Label 面积9 平方公分以上气泡直径不得大于2mm The blister diameter can not exceed 2cm in the label within 9 square cm 1.4 标签不可有破损情形 Damaged label is reject 1.5 标签漏贴或内容错误拒收 Loss label or wrong content is reject - 51 - PCBA检验规范 1.6 1.7 1.8 文字及图样印刷应鲜明可读,不可断缺、模糊、重影者 背胶不良等之异常现象不允许 卷标翘起面积大于10%标签面积拒收 Floating area of label exceed 10% is Reject 2 Barcode 外观检验 (Visual inspection) Item 品质需求Quality requirement 2.1 条形码印刷相邻两线（含）以上断裂高度大于条形码高度1/4 拒收 The height of near lines broken of label exceed 1/4 the length of label is reject 2.2 条形码断裂单线高度大于条形码长度1/3 拒收 The height of single line broken of label exceed 1/3 the length of label is reject 2.3 条形码高度为5 mm(含)以下者, 若小白点面积大于1 mm 平方(含)以上拒收 The height of label not exceed 5 mm, If the white dot exceed 1 square mm is Reject 2.4 条形码高度为6 mm ~ 10 mm 者,若小白点面积大于2 mm 平方(含)以上拒收 The height of label exceed 6~10mm, If the white dot exceed 2 square mm is reject 2.5 条形码高度为10 mm 以上者,若小白点面积大于3 mm 平方(含)以上拒收 The height of label exceed 10mm, If the white dot exceed 3 square mm is reject 3 包装袋(含静电袋,气泡袋) 外观检验 (Visual inspection) Item 品质需求Quality requirement 3.1 破损直径大于15MM 拒收 Diameter of damage exceed 15mm are reject 3.2 漏装拒收 Loss packing are reject 4 外箱(Carton) 外观检验 (Visual inspection) Item 品质需求Quality requirement 4.1 破损/凹陷直径大于20MM 拒收 Damage or concave diameter exceed 20mm are reject 4.2 沾污直径大于20MM 拒收 The diameter of stain exceed 20mm are reject 4.3 纸箱受潮拒收 Wet Box is reject - 52 - PCBA检验规范 4.4 4.5 4.6 印刷重影,模糊,造成无法辨识拒收 Printing double shadow & faintness can not be distinguished is reject Label 盖住印刷文字图面,造成无法辨识拒收 Word and drawing of printing covered by Label can not be distinguished are reject 文字图面内容错误或尺寸不符拒收 The content of word and drawing or size is wrong is reject 5 Housing 检验准则 1. 每面的检验时间是5 秒 The cycle time of inspection each side is 5 seconds 2. 以上应使用CLASS C 的检验等级 Class C was used on above 3. 不良点包括: 刮伤,加工成型沾污,表面沾污点/线,凸点,凹点,凹痕,裂痕 The defect including: scraping, stain in process of forming. Stain and the mark of concave and convex and crack in the surface 4. HOUSING 的前面及上面缺点的间隔必须>50MM; 侧面,底面,后面的缺点间隔必须>25MM. The gap of defect in the front and top of housing must exceed 50mm; and the gap of defect in the bottom and side must exceed 25mm 5. 表面不可有不可擦拭的沾污,沾污的擦拭可用未沾酒精的软布擦拭 The stains that can not be wiped off in the surface are reject. The stain can be wiped by the soft cloth with no alcohol 6. 纤细的无感刮伤(深度<0.001mm ), 纤细的流痕,成型痕迹,不可擦拭的不明显异色,其各单面上累计面积不可超过单面面积的25% Un-sensible scraping(depth no more than 0.001mm), flow mark , the mark of forming, unclear - 53 - PCBA检验规范 - 54 - 因篇幅问题不能全部显示，请点此查看更多更全内容