Flip chip package structure and fabrication proces

专利名称：Flip chip package structure and fabrication

process thereof

发明人：Xiaochun Tan申请号：US146169申请日：20170301公开号：US09735122B2公开日：20170815

专利附图：

摘要：Disclosed herein are various chip packaging structures and methods offabrication. In one embodiment, a flip chip package structure can include: (i) a pad on achip; (ii) an isolation layer on the chip and the pad, where the isolation layer includes a

through hole that exposes a portion of an upper surface of the pad; (iii) a metal layer onthe pad, where the metal layer fully covers the exposed upper surface portion of thepad; and (iv) a bump on the metal layer, where side edges of the bump do not makecontact with the isolation layer.

申请人：Silergy Semiconductor Technology (Hangzhou) LTD

地址：Hangzhou, ZheJiang Province CN

国籍：CN

代理人：Michael C. Stephens, Jr.

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