Flow sensor and method for manufacturing the same

专利名称：Flow sensor and method for manufacturing

the same

发明人：Tsutomu Kono,Keiji Hanzawa,Noboru

Tokuyasu,Shinobu Tashiro

申请号：US14391782申请日：20130411公开号：US09580303B2公开日：20170228

专利附图：

摘要：A technique capable of suppressing performance variation of every flow sensorand achieving performance improvement is provided. For example, in an arbitrary cross-

sectional surface in parallel to a moving direction of a gas flowing on an exposed flowdetecting unit FDU which is formed in a semiconductor chip CHP, a sealing body isreleased from the lower mold BM by thrusting up, from a lower mold BM, an ejection pinEJPN arranged in an outer region of the semiconductor chip CHP so as not to overlapwith the semiconductor chip CHP arranged in the vicinity of the center part. Thus,according to the first embodiment, the deformation applied to the sealing body at thetime of mold releasing can be smaller than that in a case in which the sealing body isreleased from the lower mold BM by arranging the ejection pin EJPN in a regionoverlapping with the semiconductor chip CHP

申请人：Hitachi Automotive Systems, Ltd.

地址：Hitachinaka-shi, Ibaraki JP

国籍：JP

代理机构：Crowell & Moring LLP

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